PIXAPP Pilot Line

PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot Line.

The goal of PIXAPP is to support the transition of integrated photonic devices from prototyping to medium volume manufacturing via pilot-scale production. PIXAPP offers a wide range of packaging technologies and capabilities including optical assembly, thermal stabilization and electronic integration. A key focus of PIXAPP is to establish a set of packaging design standards and related design rules which provides users with easy access to well-defined and qualified packaging technologies that are sufficiently flexible to address a wide range of markets, from communications to sensing and medical diagnostics. PIXAPP also provides advanced training to industry, including practical hands-on laboratory-based training using state-of-the-art equipment and training on advanced PIC design, test and reliability systems.

PIXAPP is funded by the European Commission in partnership with Photonics 21 and was established in January 2017.